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Project information

 logos project

Project: Nº 15010 REVaMP2 - Round-trip Engineering and Variability Management Platform and Process

Area: Smart Engineering

Number of partners: 30

Number of countries: 5

Budget: 22,049 k€

Duration: Nov 2016 - Dec 2019

Coordinator: Softeam

About REVaMP²

The ITEA 3 project REVaMP² aims to conceive, develop and evaluate the first comprehensive automation tool-chain and associated executable process to support round-trip engineering of SIS Product Lines and thereby helping to profitably engineer mass customised products and services in virtually any economic sector.

+Info REVaMP²

Latest news

Semestral Plenary in Madrid

Next semestral plenary for the European project REVaMPwill be celebrated in Madrid from January 30 - February 1, 2018. The day before the plenary, January 29, a use case workshop is organized and the day after, February 2, there will be a OSLC workshop.

The project started in November 2016 and will end in December 2019. REVaMPaims to conceive, develop and evaluate the first comprehensive automation tool-chain and associated executable process to support round-trip enbineering of Software-Intensive Systems and Services (SIS) Product Lines (PL) and thereby help to profitably engineer mass customised products and services in virtually any economic sector.

SPLC 2018 in Gothenburg, Sweden

10-14 September the 22nd International Systems and Software Product Line Conference (SPLC 2018) will be organized in Gothenburg, Sweden. The Systems and Software Product Line Conference (SPLC) is a premier forum where researchers, practitioners, and educators can present and discuss the most recent ideas, trends, experiences, and challenges in the area of software and system product lines engineering. Conference events include opportunities to hear industry leaders’ real-world experiences and researchers’ latest ideas, and to learn from both.

SPLC 2018

SPLC 2017 in Sevilla, Spain

25-29 September the International Systems and Software Product Line Conference (SPLC 2017) was organized in Sevilla, Spain. The University of Hildesheim participated with the publication "An Empirical Study of Configuration Mismatches in Linux", the University Pierre et Marie Curie participated with the publication "A Catalog of Extractive SPL Adoption Case Studies" and the University of Gothenburg participated with the publication "Challenges and Solutions for Opening Small and Medium-Scale Industrial Software Platforms".

SPLC 2017